| # | Country | Total Patents | |
|---|---|---|---|
| #1 | China | 6 | |
| #2 | EPO (European Patent Office) | 5 | |
| #3 | Finland | 5 | |
| #4 | WIPO (World Intellectual Property Organization) | 5 | |
| #5 | United States | 2 | |
| #6 | Brazil | 1 | |
| #7 | Canada | 1 | |
| #8 | Republic of Korea | 1 | |
| #9 | Malaysia | 1 |
| # | Name | Total Patents |
|---|---|---|
| #1 | Nieminen Jyri | 16 |
| #2 | Hillberg Jukka | 11 |
| #3 | Maeki Jukka | 5 |
| #4 | Hillberg Jouni | 3 |
| #5 | Jyri Nieminen | 2 |
| #6 | Mäki Jukka | 2 |
| #7 | Nieminen J | 1 |
| #8 | Maki Jukka | 1 |
| Publication | Filing date | Title |
|---|---|---|
| CN103946296A | Halogen-free polymer blend | |
| FI20085407A0 | Multi-Layer Packaging | |
| WO2006064085A2 | Novel polymers and method for the production thereof | |
| WO2006042903A2 | Packaging material | |
| FI20041362A0 | fibers | |
| EP1439953A1 | Electrically conductive covering material | |
| BR0210292A | Polymeric blend |