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Optoelectronic sub-assembly, has conductor paths to respectively connect contact surfaces contacting electrodes with contact surfaces contacting solder connection, where paths are buried below surface of case or cover
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Optoelectronic subassembly, has optical mask fixed perpendicular to sectional plane, where mask includes transparent areas whose elongation in direction perpendicular to plane is higher than elongation in direction parallel to plane
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OPTOELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
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