| # | Country | Total Patents | |
|---|---|---|---|
| #1 | China | 7 | |
| #2 | Taiwan | 7 | |
| #3 | United States | 6 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices |
| # | Name | Total Patents |
|---|---|---|
| #1 | Chen Shih-Chi | 16 |
| #2 | Chen Shiji | 4 |
| Publication | Filing date | Title |
|---|---|---|
| TW201526198A | Package module with stack components | |
| TW201517216A | Module with stack package components | |
| TW201517241A | Package module with offset stack components | |
| TW201508895A | Package module with offset stack components | |
| US2014197524A1 | Die package structure | |
| US2014183714A1 | Die package structure | |
| US2014183713A1 | Die package structure | |
| CN104183515A | Wafer testing machine stand | |
| CN104181453A | Chip testing machine | |
| TW201445149A | Wafer testing machine | |
| CN104181336A | Test module | |
| TW201443454A | Chip testing machine | |
| TW201443451A | Test module |