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ILJIN COPPER FOIL CO LTD

Overview
  • Total Patents
    71
About

ILJIN COPPER FOIL CO LTD has a total of 71 patent applications. Its first patent ever was published in 2002. It filed its patents most often in Republic of Korea, WIPO (World Intellectual Property Organization) and Taiwan. Its main competitors in its focus markets surface technology and coating, audio-visual technology and measurement are KONDO KAZUO, S M C CO LTD and CAMBRIDGE NANOTHERM LTD.

Patent filings per year

Chart showing ILJIN COPPER FOIL CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Kim Sang Beom 27
#2 Kim Sang-Beom 16
#3 Ryu Jong Ho 16
#4 Yoon Byung Young 14
#5 Park Jin Su 13
#6 Park Jung Won 13
#7 Cho Jung Hwan 11
#8 Lee Dong-Nyung 9
#9 Kang Kyoo-Sik 9
#10 Ryu Jong-Ho 8

Latest patents

Publication Filing date Title
WO2010056076A2 Electrode wire for a solar battery, and manufacturing method thereof
KR20100037008A Nox gas sensor
WO2010038990A2 Nitrogen-oxide gas sensor
KR20100037010A Nox gas sensor
WO2010038987A2 Nitrogen-oxide gas sensor with long signal stability
KR20100096610A Nox gas sensor control unit
KR20100055096A Electrode wire for solar cell and method for preparing the same
KR20100055095A Electrode wire for solar cell and method for preparing the same
KR20100036727A Nox gas sensor
KR20100036726A Nox gas sensor having
KR20100009262A Silane based compound, method for preparing the same, and copper foil surface treatment agent composition comprising the same
KR20100009263A Copper foil for flexible printed circuit board, method for preparing the same, and flexible copper clad laminate using polyamic acid precursor and copper foil
KR20090114118A Metal frame for electronic part
KR20090072423A Copper foil attached to the carrier foil, a method for preparing the same and printed circuit board using the same
WO2008082191A1 Pb-free solder alloy
EP2126159A1 Sn-b plating solution and plating method using it
KR20080014555A The resin composition for copper clad laminate, copper clad comprising the same and method for manufacturing the same
KR20060006389A Method of manufacturing surface-treated copper foil for pcb having fine-circuit pattern and surface-treated copper foil thereof
KR20050114839A Method for manufacturing black surface-treated copper foil for emi shield and the copper foil the same and the composite material using it
KR20050103619A Method of manufacturing filter for emi shield