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HUIZHOU CHINA EAGLE ELECTRONIC TECHNOLOGY CO LTD

Overview
  • Total Patents
    28
  • GoodIP Patent Rank
    233,270
About

HUIZHOU CHINA EAGLE ELECTRONIC TECHNOLOGY CO LTD has a total of 28 patent applications. Its first patent ever was published in 2009. It filed its patents most often in China and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets audio-visual technology are TOUTOKU TORYO KK, TOLOCHEK VALERIJ N and TAISEI SHOKAI KK.

Patent filings in countries

World map showing HUIZHOU CHINA EAGLE ELECTRONIC TECHNOLOGY CO LTDs patent filings in countries

Patent filings per year

Chart showing HUIZHOU CHINA EAGLE ELECTRONIC TECHNOLOGY CO LTDs patent filings per year from 1900 to 2020

Focus industries

Focus technologies

Top inventors

# Name Total Patents
#1 Gang Zhou 11
#2 Zhao Zhiping 9
#3 Zhou Gang 8
#4 Zhiping Zhao 5
#5 Liu Dewei 4
#6 Dong Liu 4
#7 Li Xiaohai 4
#8 Ye Hanxiong 4
#9 Yao Zhao 3
#10 Hanxiong Ye 3

Latest patents

Publication Filing date Title
CN105163528A Riveting method and riveting structure for lamination of multilayer PCB
CN103648242A Vacuum glue filling method of blind buried hole with high aspect ratio
CN103561543A PCB countersunk groove processing method
CN103313518A Manufacturing method for flexible printed circuit (FPC) single-side ultra-thin base material line
CN103345132A Method for aligning outer layer film PIN nails
CN103298262A Flexible printed circuit (FPC) dry film sticking control method
CN103302183A PCB aluminum substrate stamping die and processing method of PCB aluminum substrate diameter
CN103118495A PCB (printed circuit board) manufacturing process
CN103118486A Aluminum based circuit board with component plug holes and manufacturing method of aluminum based circuit board
CN103088396A Chemical water treatment method for PCB (printed circuit board) electro-coppering trough
CN103017669A Method for detecting thicknesses of welding resistant layer of printed circuit board (PCB)
CN103338599A Manufacturing process of rigid-flex combined PCB (printed circuit board)
CN102811567A Flexible and rigid combined plate process and uncapping method
CN102647857A Manufacture process of printed circuit board
CN102647859A Producing process for carbon ink of circuit board
CN102612276A Manufacturing process for pores of multilayer HDI (high density interconnector) circuit board
CN102548066A PCB (Printed Circuit Board) surface treatment technology
CN102244988A Manufacturing process of PCB (Printed Circuit Board)
CN102186306A Metal base circuit board and manufacturing method thereof
CN102218753A Method for shaping PCB (Printed Circuit Board) by stamping