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HSU CHENG-CHIEN

Overview
  • Total Patents
    29
  • GoodIP Patent Rank
    212,968
About

HSU CHENG-CHIEN has a total of 29 patent applications. Its first patent ever was published in 2007. It filed its patents most often in Taiwan, United States and Netherlands. Its main competitors in its focus markets measurement, audio-visual technology and machines are DAE JI ENGNEERING CO LTD, SENSCAPE TECH (BEIJING) CO LTD and M7 VISUAL INTELLIGENCE LP.

Patent filings in countries

World map showing HSU CHENG-CHIENs patent filings in countries

Patent filings per year

Chart showing HSU CHENG-CHIENs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Hsu Cheng-Chien 29

Latest patents

Publication Filing date Title
US9200667B1 Suction cup
EP2878836A1 Suction cup
JP2016048082A Suction cup
US2013014969A1 Structure of casing of electronic device
TW201304959A Fabrication and processing method of thermoplastic carbon fiber plate
CH699561A2 Cover element i.e. cover shield, for covering global positioning system, has hinge for attaching cover element with host device, which has butt joint, such that cover element is mounted on and demounted from host device
CH699488A2 Global Positioning System with a photographing.
CH699489A2 Terminal a global positioning system.
US2010292925A1 Direction indication device of a global positioning system
AU2008100781A4 Photographing device of a Global Positioning System
GB0815054D0 Direction indicating device for a GPS receiver
AU2008100780A4 Direction Indication Device of a Global Positioning System
AU2008100779A4 Cover Member of a Global Positioning System
US2010327711A1 Cover member of a global positioning system
US2010329662A1 Photographing Device of a Global Positioning System
GB0813966D0 A GPS and image capture device allowing routes planned by a user to be watched dynamically
GB0813969D0 Removable cover member of a global positioning system
TW200946364A Method for processing the surface of multiple alloy plates
TW200938303A Spray-painting process
TW200932932A Surface treatment method for electronic apparatus casing (III)