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HITACHI KASEI POLYMER CO LTD

Overview
  • Total Patents
    280
About

HITACHI KASEI POLYMER CO LTD has a total of 280 patent applications. Its first patent ever was published in 1993. It filed its patents most often in Japan, WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets macromolecular chemistry and polymers, basic materials chemistry and machines are THREE BOND FINE CHEMICAL CO LTD, CHANGZHOU HUAKE POLYMERS CO LTD and SURFACE SPECIALTIES SA.

Patent filings per year

Chart showing HITACHI KASEI POLYMER CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Hasegawa Katsuro 26
#2 Oba Hisae 23
#3 Fujita Hiroyuki 23
#4 Sonoda Yusuke 20
#5 Sugihara Takashi 19
#6 Koizumi Fumio 17
#7 Matsumiya Hisao 16
#8 Horie Kenji 15
#9 Taniguchi Tomoaki 14
#10 Kuwabara Noriko 14

Latest patents

Publication Filing date Title
JP2014065781A Production method of laminate member and hot melt resin composition used for the same
JP2014051631A Hot melt resin composition for cardboard
JP2014015530A A sealing material for buildings
JP2014009289A Moisture-curable reactive hot-melt adhesive composition
JP2013249367A Double-sided pressure-sensitive adhesive tape
JP2013163704A Active energy ray-curable release agent composition, method for forming coated film using the same, and release liner
JP2013087146A Primer composition
JP2013087147A Adhesive composition for wooden board
JP2013035954A Hot-melt resin composition
JP2012207076A Thermally active adhesive and thermally active adhesive film
JP2012188490A Hot melt resin composition for sealing, and electronic part device
JP2012180472A Adhesive composition for flexible printed wiring board and coverlay film using the same
JP2012107117A Active energy ray curable release agent composition, method of forming coated film using the same, and release liner
JP2011001561A Polyester polyol composition
JP2012054396A Adhesive composition for solar cell back sheet and solar cell back sheet
JP2011233750A Adhesive composition for solar cell back sheet and solar cell back sheet
JP2011190421A Active energy ray-curable adhesive composition
JP2011068822A Adhesive film with separator
JP2011037971A Transparent adhesive resin composition for wiring board and transparent adhesive film for wiring board using the same
JP2010275500A Active energy ray curable release agent composition, method of forming coated film using the same, and release liner