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Henkel huawei electronics co ltd

Overview
  • Total Patents
    13
  • GoodIP Patent Rank
    183,858
About

Henkel huawei electronics co ltd has a total of 13 patent applications. Its first patent ever was published in 2010. It filed its patents most often in China and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets macromolecular chemistry and polymers, semiconductors and materials and metallurgy are MELIOR INNOVATIONS INC, KONSTRAKSHN RISERCH END TEKNOLODZHI GMBKH and HEFEI E-CHON METAL PLATE TECH CO LTD.

Patent filings in countries

World map showing Henkel huawei electronics co ltds patent filings in countries

Patent filings per year

Chart showing Henkel huawei electronics co ltds patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Xie Guangchao 6
#2 Jia Lufang 4
#3 Ding Quanqing 4
#4 Jin Song 3
#5 Liu Chengjie 3
#6 Qian Ying 3
#7 Chen Bo 3
#8 Ding Dong 2
#9 Fang Wenxiang 2
#10 Yang Qingxu 2

Latest patents

Publication Filing date Title
CN108140620A For the epoxy molding compounds of high-power SOIC semiconductor packages application
CN107406328A Alumina ceramic of black color powder, alumina ceramic of black color body prepared therefrom and the method for preparing the alumina ceramic of black color body
CN108350251A Epoxy molding compounds, preparation method and use and the transistor outline package product comprising its layered product
CN108292692A A kind of manufacturing method of optical semiconductor device, for its compositions of thermosetting resin and by the optical semiconductor of its acquisition
CN108026355A Composition epoxy resin, its preparation and use
CN103450632A Epoxy resin composition for electronic packaging and preparation method thereof
CN103421274A Epoxy resin composition used for electronic packaging and preparation method of epoxy resin composition
CN103421275A Epoxy resin composition used for electronic packaging and preparation method thereof
CN103421279A Epoxy resin composition used for electronic packaging and preparation method thereof
CN103421272A Epoxy resin composition used for electronic packaging and preparation method thereof
CN102061440A Metal surface treatment method, products produced thereby and application of products