| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Japan | 18 | |
| #2 | Taiwan | 1 | |
| #3 | United States | 1 | |
| #4 | WIPO (World Intellectual Property Organization) | 1 | |
| #5 | South Africa | 1 |
| # | Industry | |
|---|---|---|
| #1 | Materials and metallurgy | |
| #2 | Surface technology and coating | |
| #3 | Electrical machinery and energy | |
| #4 | Environmental technology | |
| #5 | Machine tools | |
| #6 | Machines | |
| #7 | Semiconductors |
| # | Name | Total Patents |
|---|---|---|
| #1 | Kumar Prabhat | 6 |
| #2 | Miller Steven A | 5 |
| #3 | Thomas Oliver | 4 |
| #4 | Zimmermann Stefan | 4 |
| #5 | Shekhter Leonid N | 4 |
| #6 | Wu Richard | 4 |
| #7 | Schmidt-Park Olaf | 4 |
| #8 | Lanin Leonid L | 4 |
| #9 | Sun Shuwei | 4 |
| #10 | Vieregge Joachim | 4 |
| Publication | Filing date | Title |
|---|---|---|
| US2018203536A1 | Current-induced dark layer formation for metallization in electronic devices | |
| TW201728388A | High-entropy alloy wire and multi-principal element alloy wire, and the preform, manufacture method and application thereof |