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HBL CORP

Overview
  • Total Patents
    31
  • GoodIP Patent Rank
    214,502
  • Filing trend
    ⇩ 100.0%
About

HBL CORP has a total of 31 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2000. It filed its patents most often in Republic of Korea, China and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets machine tools, optics and semiconductors are NEW WAVE RES, MIYACHI TECHNOS KK and ESI PYROPHOTONICS LASERS INC.

Patent filings in countries

World map showing HBL CORPs patent filings in countries

Patent filings per year

Chart showing HBL CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Kim Jeong Moog 23
#2 Kim Jeong Muk 7
#3 Lee Kang Soo 2
#4 Kim In Ho 1
#5 Choi Byeong Gyu 1
#6 Choi Byung Kew 1
#7 Lee Jae Sin 1
#8 Han You Hie 1
#9 Choi Gi Yeong 1

Latest patents

Publication Filing date Title
KR101709566B1 Deep Engraving Apparatus Using Pulse Laser Beam
KR20120098253A Multi-head high speed laser engraving device
KR20120076176A Multi-functional laser apparatus for sequential conversion
KR20120076177A Deep engraving system using pulse laser beam
KR20120033869A Body tube of articulated beam transfer device
KR20120005892A The structure of a laser beam generator
KR20120001504A The structure of cooling system in laser beam generator
KR20110131831A System provided laserbeam detraction with excellent linear characteristic and monitoring of optical system pollution
KR20110131832A Laser system for output measurement and prevention of exit-hole damage and method of check normality
KR20090100986A Silicon wafer cutting method using of picosec laser device
KR20090083791A Pack coating laser marking method for marking recognition
KR100857595B1 Laser processing apparatus using drum and method
KR20090043169A Laser processing method and appratus using stabilized output power by the first diffraction of acousto-optic device
KR20060069392A Density-response device step by step
KR20060102261A Scribing method and cutting method for glass using mode-locked uv-laser
KR20060100773A A semiconductor wafer dicing and scribing system and appratus with a high speed laser beam focus positioning system to arbitrary 3d positions and laser beam diffraction system
KR20060090130A High speed laser beam focus positioning system and its methods
KR20060025940A Laser welding method for sealing liquid electrolyte injection hole of battery can
KR20050121832A Laser scribing or cutting method using acoustooptic modulator
KR20050108719A Pulse laser power supply design and its using rapid rise-time for less thermal distortion