HB TECHNOLOGY CO LTD has a total of 12 patent applications. It decreased the IP activity by 50.0%. Its first patent ever was published in 2011. It filed its patents most often in Republic of Korea, Taiwan and China. Its main competitors in its focus markets measurement, optics and audio-visual technology are ULTRAPOINTE CORP, 3DHISTECH KFT and TOMOCUBE INC.
# | Country | Total Patents | |
---|---|---|---|
#1 | Republic of Korea | 5 | |
#2 | Taiwan | 3 | |
#3 | China | 2 | |
#4 | United States | 2 |
# | Industry | |
---|---|---|
#1 | Measurement | |
#2 | Optics | |
#3 | Audio-visual technology | |
#4 | Computer technology | |
#5 | Packaging and shipping |
# | Technology | |
---|---|---|
#1 | Optical systems | |
#2 | Analysing materials | |
#3 | Measuring length, angles and areas | |
#4 | Nonlinear optics | |
#5 | Image data processing | |
#6 | Measuring electric variables | |
#7 | Television | |
#8 | Transport or storage devices |
# | Name | Total Patents |
---|---|---|
#1 | Rhew Choongyop | 3 |
#2 | Lee Seungkeun | 3 |
#3 | Park Daisoung | 3 |
#4 | An Hyeon Goo | 2 |
#5 | Park Do Kyong | 2 |
#6 | Im Hyung Sik | 1 |
#7 | Lee Seung-Keun | 1 |
#8 | Park Jong Sun | 1 |
#9 | Rhew Choong-Yop | 1 |
#10 | Jung Seung Hwan | 1 |
Publication | Filing date | Title |
---|---|---|
KR20160108643A | bonding wire chip inspection apparatus | |
KR20160108644A | Device for detecting defect of device | |
KR101600996B1 | Backlight unit with high color uniformity and display apparatus using the same | |
KR101540179B1 | Review measurement path algorithm | |
KR20130077709A | Back light unit and optical display apparatus comprising the same |