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Method for producing a multi-layer circuit board with contacting of inner layers, and multi-layer circuit board and production system
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Process for producing an electronic device in the form of an injection-molded part with an inserted printed circuit board
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Method for producing a printed circuit board with reinforced copper structure
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Method of making a via in a multilayer printed circuit board
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Multi-layer printed circuit board with heat-conducting element
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Multi-layer printed circuit board with integrated, plastically bendable thick copper profile
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Printed circuit board with at least one four-pole current measuring element
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Printed circuit board with thermal contacting elements
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Multi-functional multilayer printed circuit boards with an electrically conductive high-current conductive structure and method of manufacture
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