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HANWHA PREC MACHINERY CO LTD

Overview
  • Total Patents
    101
  • GoodIP Patent Rank
    14,351
  • Filing trend
    ⇧ 161.0%
About

HANWHA PREC MACHINERY CO LTD has a total of 101 patent applications. It increased the IP activity by 161.0%. Its first patent ever was published in 2013. It filed its patents most often in Republic of Korea, United States and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets packaging and shipping, audio-visual technology and computer technology are ESTUN ROBOTICS CO LTD, DONGGUAN SHINYOU INTELLIGENT TECH CO LTD and ROBOTICS ROBOTICS SHENZHEN LTD.

Patent filings per year

Chart showing HANWHA PREC MACHINERY CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Yoon Eun Suk 8
#2 Lee Byung Hoon 8
#3 Ban Jong Eok 8
#4 Song Chang Woo 8
#5 Kim Byung Ju 7
#6 Jo Sung Ho 6
#7 Jang Jae Ho 5
#8 Lee Jin Jae 5
#9 Kim Jin Soo 5
#10 Lee Na Youn 5

Latest patents

Publication Filing date Title
KR20210023443A Driving control method of the component mounting apparatus
KR20210023583A Method and computer program for determining defective part and Chip Mounter
KR20200139908A Component mounting apparatus
KR20200114597A Automatic Nozzle Exchanger
KR20200108998A A head stock of a lathe having a function of adjusting chucking force
KR20200107106A Building and operation system of parts library using token
KR20200106618A Component imaging apparatus
KR20200098896A Piezoelectric dispenser
KR20200095711A Apparatus for inspection of part
KR20200087539A Apparatus and method for detecting an electronic part
KR20200063863A Apparatus for synchronizing reference coordinates
KR20200059066A Wafer dicing method and apparatus
KR20200058031A Apparatus for coating phosphor on LED and method for coating phosphor on LED
KR20200028785A A substrate clamp device
KR20200022221A Apparatus for determining chip mounting sequence
KR20200019038A Method for determining mounting components of multiple chip mounter
KR20200016683A Apparatus and method for manufacturing semiconductor
KR20200005334A Bonding apparatus
KR20200001864A Apparatus for dumping component
KR20190138204A Bonding apparatus