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Chip-packaging structure and preparation method thereof with double cofferdam and metal layer
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Multichip packaging structure and preparation method thereof with multi-chamber
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With the chip-packaging structure and preparation method thereof for extending double cofferdam
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Chip-packaging structure and preparation method thereof with single cofferdam and scolding tin
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Chip-packaging structure and preparation method thereof with single cofferdam
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The multi-chamber encapsulating structure and preparation method thereof of RF switch chip electrode peripheral hardwares
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Chip-packaging structure and preparation method thereof with single cofferdam and outer Mobile Communication hole
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With extension double cofferdam and the chip-packaging structure of metal layer and preparation method thereof
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With the multichip packaging structure and preparation method thereof for accommodating filter chip chamber
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The multi-chamber encapsulating structure and preparation method thereof of amplifier chip electrode peripheral hardware
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Encapsulating structure and preparation method thereof with double cofferdam and scolding tin
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With extension double cofferdam and the chip-packaging structure of scolding tin and preparation method thereof
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Chip-packaging structure and preparation method thereof with single cofferdam, metal column and scolding tin
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Peripheral hardware formula multichip packaging structure and preparation method thereof
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