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FLEXCOM INC

Overview
  • Total Patents
    26
  • GoodIP Patent Rank
    190,327
About

FLEXCOM INC has a total of 26 patent applications. Its first patent ever was published in 2005. It filed its patents most often in Republic of Korea, Japan and China. Its main competitors in its focus markets audio-visual technology, electrical machinery and energy and measurement are HIROSHIGE KATSUYA, GSHARP CORP and LIN GWUN-JIN.

Patent filings in countries

World map showing FLEXCOM INCs patent filings in countries
# Country Total Patents
#1 Republic of Korea 20
#2 Japan 4
#3 China 2

Patent filings per year

Chart showing FLEXCOM INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Uhm Tae Seung 4
#2 Ha Gyeong Tae 3
#3 Na Byoung Soun 2
#4 Kim Hyeon U 2
#5 Ha Dong Won 2
#6 Choi Jae Young 2
#7 Gyeong-Tae Ha 1
#8 Kim Hyun Woo 1
#9 Kim Hyun-Woo 1
#10 Park Jeong Gi 1

Latest patents

Publication Filing date Title
KR101602318B1 Method for manufacturing the Embedded FPCB
KR101588570B1 All in one test apparatus for fpcb of finished product
KR101602725B1 Method for manufacturing the Embedded FPCB
KR101520846B1 Jig for panel board assembly and pba processing method using the same
KR20160041303A Method for manufacturing FPCB using seed layer
KR101368963B1 Microphone test apparatus
KR101418867B1 Methode for manufacturing Multi-Layer FPCB
KR101254623B1 Flexible printed circuit having capacitor and method the same
KR101154856B1 Scraping methode for flexible print circuit board having shield metal foil and apparatus the same
KR101101863B1 Jig for attaching supporting members onto flexible printed circuit board
KR101092987B1 Fpcb having bending part and methode the same
KR100997089B1 Method for manufacturing double-sided tape
KR100961272B1 Mounting structure and mounting method of parts on the flexible printed circuit board
KR100972299B1 Structure and manufacturing method of flexible cable for connector connection
KR100941584B1 A method of manufacturing external form for band-type pcb
KR20070076590A Rigid flexible printed circuit board and manufacturing method thereof
KR100582425B1 Via hall filling method for circuit board
KR100603213B1 Interlayer separation method for multi layer flexible board
KR100571726B1 Rigid flexible printed circuit board and manufacturing method thereof
KR100556174B1 Plating method for flexible print circuit board