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FLEX LTD

Overview
  • Total Patents
    237
  • GoodIP Patent Rank
    6,193
  • Filing trend
    ⇧ 136.0%
About

FLEX LTD has a total of 237 patent applications. It increased the IP activity by 136.0%. Its first patent ever was published in 2009. It filed its patents most often in United States, China and EPO (European Patent Office). Its main competitors in its focus markets environmental technology, semiconductors and audio-visual technology are UNIVERSAL SCIENT IND (SHANGHAI) CO LTD, UNIVERSAL SCIENT IND CO LTD and UNIVERSAL SCIENT INDUSTRIAL SHANGHAI CO LTD.

Patent filings per year

Chart showing FLEX LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Zhou Lisong 52
#2 Zhou Huaming 43
#3 Kilburn Christopher Bjorn 32
#4 Lucrecio Armando J 24
#5 Mohammed Anwar 12
#6 Kurwa Murad 12
#7 Musser Jordon 10
#8 Geiger David 9
#9 Tan Jesus 8
#10 Vince Nate 8

Latest patents

Publication Filing date Title
US2021095401A1 Composite textile structure for sensing, activation, and signal network
US2021094270A1 Additive manufacturing of highly flexible electrophoretic film and textile composites
US2020280208A1 Automatic ac feed control (afc) with zero voltage/current switching
CN111641256A Automatic AC Feed Control (AFC) with zero voltage/current switching
US2020212601A1 Devices, systems, and methods for directional antennas that protect sensitive zones
US2020207057A1 Integrated actuator for extended functional fabric
US2020208311A1 Plaited low-melt yarn for adhering fabric
US2021100106A1 Methods of creating exposed cavities in molded electronic devices
US2021125958A1 Embedded copper structure for microelectronics package
US2020119431A1 Capacitively coupled label antenna
US10985484B1 Electronic conductive interconnection for bridging across irregular areas in a textile product
US10653010B1 Connection of multilayer printed conductive ink through filled microvias
US2021076496A1 Solder electronic components to printed conductive ink
US2021057990A1 Dc/dc transformer for power transmission in telecom applications
US2020086585A1 Assembly of sub-components by compression molding
CN110901076A Assembly of sub-components by compression moulding
US2021013155A1 Multi-metal package stiffener
US2020344891A1 Electronics encapsulation through hotmelt lamination
US2020404780A1 Stress relief encapsulation for flexible hybrid electronics
US2020395627A1 Extended temperature and lifecycle for battery operated asset trackers