FIDELICA MICROSYSTEMS INC has a total of 30 patent applications. Its first patent ever was published in 2000. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and Australia. Its main competitors in its focus markets machines, measurement and computer technology are COLUMBIA CONTROLS RESEARCH COR, INTERPRINT FORMULARIOS LTD and BALL KARLHEINZ.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 17 | |
#2 | WIPO (World Intellectual Property Organization) | 5 | |
#3 | Australia | 4 | |
#4 | Taiwan | 4 |
# | Industry | |
---|---|---|
#1 | Machines | |
#2 | Measurement | |
#3 | Computer technology | |
#4 | Micro-structure and nano-technology | |
#5 | Electrical machinery and energy |
# | Name | Total Patents |
---|---|---|
#1 | Prakash Shiva | 23 |
#2 | Ganapathi Srinivasan K | 13 |
#3 | Gluck Randolph S | 13 |
#4 | Hovey Steven H | 8 |
#5 | Ganapathi Srinavasan K | 7 |
#6 | Deconde Keith T | 6 |
#7 | Hovey Steve H | 5 |
#8 | Ganapathi Srinivasan | 4 |
#9 | Dobkin Robert | 3 |
#10 | Diamant Joram | 1 |
Publication | Filing date | Title |
---|---|---|
US2005223818A1 | Method and apparatus for protection of contour sensing devices | |
US6612161B1 | Atomic force microscopy measurements of contact resistance and current-dependent stiction | |
US6672174B2 | Fingerprint image capture device with a passive sensor array | |
US7059201B2 | Use of multi-layer thin films as stress sensors | |
AU6355600A | Use of multi-layer thin films as stress sensors | |
US6578436B1 | Method and apparatus for pressure sensing | |
US6694822B1 | Use of multi-layer thin films as stress sensor | |
US6889555B1 | Magnetoresistive semiconductor pressure sensors and fingerprint identification/verification sensors using same |