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EXSENSE ELECTRONICS TECH CO LTD

Overview
  • Total Patents
    38
  • GoodIP Patent Rank
    40,803
  • Filing trend
    ⇧ 42.0%
About

EXSENSE ELECTRONICS TECH CO LTD has a total of 38 patent applications. It increased the IP activity by 42.0%. Its first patent ever was published in 2015. It filed its patents most often in China, United States and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets electrical machinery and energy, measurement and surface technology and coating are PIHER NAVARRA SA, UNIROYAL ELECTRONICS IND CO LTD and SERGEEV BORIS.

Patent filings in countries

World map showing EXSENSE ELECTRONICS TECH CO LTDs patent filings in countries

Patent filings per year

Chart showing EXSENSE ELECTRONICS TECH CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Yang Jun 38
#2 Duan Zhaoxiang 37
#3 Tang Limin 35
#4 Bai Qixing 31
#5 Ye Jiankai 12
#6 He Xiaodong 9
#7 Xu Zhiyong 4
#8 Huang Junwei 4
#9 Tang Liming 3
#10 Deng Yifang 3

Latest patents

Publication Filing date Title
CN111029065A High-precision and high-reliability Ir-Cu-Au composite electrode thermosensitive chip
CN111128494A Thermosensitive chip with stress buffering metal electrode structure
CN111180203A High-precision and high-reliability Ir-Cu-Au composite electrode chip capacitor
CN111009363A High-precision and high-reliability Mo-Cu-Au composite electrode thermosensitive chip
CN111180204A Stress buffering metal electrode structure chip capacitor
CN111029068A High-precision and high-reliability composite film electrode thermosensitive chip
CN111048271A High-precision and high-reliability Cr/Ni-Cu-Au composite electrode thermosensitive chip
CN111029069A Tm2O3Rare earth element modified high-temperature-resistant high-reliability NTC semiconductor ceramic thermosensitive chip material
CN110931191A Lu2O3Rare earth element modified high-temperature-resistant high-reliability NTC semiconductor ceramic thermosensitive chip material
CN111029070A Sc2O3Rare earth element modified high-temperature-resistant high-reliability NTC semiconductor ceramic thermosensitive chip material
CN109585162A Low stress single layer of chips capacitor and preparation method thereof
CN109637764A Highly reliable multilayer low-resistance heat sensitive chip and preparation method thereof in high precision
CN109724716A Multi-layer film type high sensitivity thermosensitive temperature-sensing chip and preparation method thereof
CN109712767A A kind of highly reliable glass packaged thermosensitive resistor chip and preparation method thereof
CN109727741A A kind of chip glass packaging technology
CN109576655A A kind of highly reliable Ti/W-Cu-Au combination electrode heat sensitive chip of high-precision
CN109659104A A kind of highly reliable two-sided Heterogeneous Composite electrode heat sensitive chip
CN109712811A A kind of two-sided Heterogeneous Composite electrode chip capacitor of high temperature resistant
CN108039256A A kind of thermal resistance row chip and preparation method thereof
CN108109791A A kind of surface-adhered type thermal-sensitive electric resistance device and preparation method thereof