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ELEKTRONISCHE BAUELEMENTE VEB

Overview
  • Total Patents
    207
About

ELEKTRONISCHE BAUELEMENTE VEB has a total of 207 patent applications. Its first patent ever was published in 1965. It filed its patents most often in German Democratic Republic, Germany and Poland. Its main competitors in its focus markets macromolecular chemistry and polymers, electrical machinery and energy and basic communication technologies are UCHREZHDENIE ROSSIJSKOJ AKADEMII NAUK INST SINT POLIMERNYKH MATERIALOV IM N S ENIKOLOPOVA RAN ISPM R, DOW CORNING TORAY SILICONE and KASHIWAGI TSUTOMU.

Patent filings in countries

World map showing ELEKTRONISCHE BAUELEMENTE VEBs patent filings in countries

Patent filings per year

Chart showing ELEKTRONISCHE BAUELEMENTE VEBs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Strehl Ralf 14
#2 Wilcke Burghard 13
#3 Kasper Eberhard 13
#4 Teuschler Hans-Joachim 12
#5 Richter Karin 9
#6 Schuetze Joerg 6
#7 Schmidt Christoph 6
#8 Berger Wolfgang 6
#9 Haelsig Christian 5
#10 Gesemann Renate 5

Latest patents

Publication Filing date Title
DD291783A5 Atomizing device with rotating substrate carrier
DD299143A7 Method for avoiding loss of wire tender in cutting wire resistives
DD289280A5 Process for certaining epoxy resin systems
DD288261A5 Multilayer connecting contact for thin and thick-water resistives
DD287059A5 Method for the wet chemical frequency correction of mechanical resonators
DD286505A5 Method for extracting juice by steam and mechanical pressure
DD284311A5 Monolithic crystal filter
DD284313A5 Monolithic piezoelectric filter
DD284314A5 Monolithic quartz filter and method for the production thereof
DD284312A5 Piezoelectric frequency filter
DD282769A5 Circuit arrangement for measuring small capacities
DD282320A5 Chip resistant with volume line and method for the production thereof
DD280795A1 Device and method for structuring substrates through plasma acts
DD280419A1 Quaderfoermige chipleitbruecke
DD282319A5 Precio-metal-free chip line brueck and method for the production thereof
DD279369A1 Sputter arrangement with fixed sputter source
DD291210A5 Acoustic electronic component with high overpressure damage
DD279352A1 Connections for acoustic electronic element for increasing overpressure damage
DD279359A1 Acoustic electronic element with increased overpressure
DD279032A1 Process for producing duenner organic semiconductor layers