ECO A CO LTD has a total of 17 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2010. It filed its patents most often in Japan, WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets machines, mechanical elements and electrical machinery and energy are KLN ULTRASCHALL GMBH, SP KT B TEKHNOPRIBOR and CELLULOSE SIDAC SOCIETE ANONYM.
# | Country | Total Patents | |
---|---|---|---|
#1 | Japan | 8 | |
#2 | WIPO (World Intellectual Property Organization) | 5 | |
#3 | China | 2 | |
#4 | Taiwan | 1 | |
#5 | United States | 1 |
# | Industry | |
---|---|---|
#1 | Machines | |
#2 | Mechanical elements | |
#3 | Electrical machinery and energy | |
#4 | Surface technology and coating | |
#5 | Machine tools | |
#6 | Medical technology | |
#7 | Engines, pumps and turbines |
# | Technology | |
---|---|---|
#1 | Shaping of plastics | |
#2 | Soldering, welding and flame cutting | |
#3 | Layered products | |
#4 | Special electric heating or lighting | |
#5 | Nails | |
#6 | Servomotors | |
#7 | Fillers | |
#8 | Cyclically operating valves | |
#9 | Dentistry |
# | Name | Total Patents |
---|---|---|
#1 | Mizuno Yoshinobu | 17 |
#2 | Ito Makoto | 5 |
#3 | Kuriyama Osamu | 4 |
#4 | Kabasawa Hitoshi | 2 |
#5 | Ohama Kozo | 2 |
#6 | Nakamura Takeshi | 1 |
Publication | Filing date | Title |
---|---|---|
WO2020235593A1 | Dental device and production method therefor | |
WO2020235603A1 | Engine valve and method for manufacturing same | |
WO2020179855A1 | Conduction diffusion bonding device | |
JP2018183246A | Mouthpiece, and production method of mouthpiece | |
CN108698336A | Electrified regulation engagement fixture and use its electrified regulation engagement device | |
CN107407309A | The junction structure of resinite and metallic object, support and working cylinder | |
JP2014235062A | Position detection sensor | |
JP2014129843A | Attachment structure of cylinder | |
JP2014129853A | Port part connection structure of cylinder | |
JP2014101894A | Sensor fixture | |
JP2014000741A | Insert molding apparatus and method | |
JP2013166349A | Conduction heating joining device and method | |
WO2013065175A1 | Current diffusion bonding apparatus and current diffusion boding method | |
JP2012006068A | Device and method for electric diffusion joining |