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DUKSAN HIGH METAL CO LTD

Overview
  • Total Patents
    390
  • GoodIP Patent Rank
    14,481
  • Filing trend
    ⇩ 62.0%
About

DUKSAN HIGH METAL CO LTD has a total of 390 patent applications. It decreased the IP activity by 62.0%. Its first patent ever was published in 2000. It filed its patents most often in Republic of Korea, WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets semiconductors, organic fine chemistry and environmental technology are SFC CO LTD, DUK SAN NEOLUXCO LTD and KYULUX INC.

Patent filings in countries

World map showing DUKSAN HIGH METAL CO LTDs patent filings in countries

Patent filings per year

Chart showing DUKSAN HIGH METAL CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Park Jung Hwan 159
#2 Kim Dong Ha 148
#3 Choi Dae Hyuk 146
#4 Lee Bum Sung 89
#5 Lee Sun Hee 86
#6 Mun Soung Yun 79
#7 Park Jung Cheol 78
#8 Kim Dae Sung 73
#9 Park Yong Wook 68
#10 Kim Ki Won 61

Latest patents

Publication Filing date Title
KR20190062295A Apparatus and method for preparing metal organic acid and product prepared by the same
KR102061203B1 Solder paste and foil with low melting point and heat resistance
KR20190062193A Thin layer bonding method for low temperature bonding
KR20190074140A Electro Magnetic Interference blocking compositions for semiconductor lead frame
KR20170102445A Solder powder with exothermic and amorphous characteristics manufacture method and solder paste manufacture method and solder paste using low temperature bonding method
KR20190012391A Non-conductive paste for chip bonding using the solder bump and method of chip bonding using the same
KR20170082487A Solder alloy, solder ball and manufacturing method thereof
KR20170108892A Thin Layer Material for low temperature bonding
WO2017160132A2 Thin film material for low temperature bonding
KR20180054036A Solder ball and embedded chip package of semiconductor using the same
KR20180046258A Solder ball and Package of semiconductor using the same
KR20180041394A Conductive paste for reflection film to prevent diffusion between the metal
WO2017014605A1 Metal plating film having heat-generating and amorphous properties and method for manufacturing same, use of same and low-temperature bonding method using same
KR20180008211A Heat dissipation conductive paste and method for manufacturing the same
KR20170125572A Solder ball, method of manufacturing the same and electronic parts using the same
KR20170125557A Solder ball, method of manufacturing the same and electronic parts using the same
KR20170123003A device for opening circuit
WO2016171526A1 Low-temperature sintering bonding material using exothermic reaction caused by nano-grain size, and method for manufacturing same
WO2016171525A1 Bonding material with exothermic and amorphous characteristics and method for manufacturing same
KR20170089571A Flux for solder and the manufacturing method thereof and the electric device comprising thereof