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DOW CORNING TORAY CO LTD

Overview
  • Total Patents
    2,446
  • GoodIP Patent Rank
    2,661
  • Filing trend
    ⇧ 13.0%
About

DOW CORNING TORAY CO LTD has a total of 2,446 patent applications. It increased the IP activity by 13.0%. Its first patent ever was published in 1997. It filed its patents most often in WIPO (World Intellectual Property Organization), China and Japan. Its main competitors in its focus markets macromolecular chemistry and polymers, basic materials chemistry and semiconductors are DOW CORNING TORAY SILICONE, DOW CORNING and UCHREZHDENIE ROSSIJSKOJ AKADEMII NAUK INST SINT POLIMERNYKH MATERIALOV IM N S ENIKOLOPOVA RAN ISPM R.

Patent filings per year

Chart showing DOW CORNING TORAY CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Morita Yoshitsugu 272
#2 Iimura Tomohiro 268
#3 Furukawa Haruhiko 229
#4 Yoshitake Makoto 198
#5 Hori Seiji 176
#6 Kato Tomoko 143
#7 Tamura Seiki 124
#8 Suto Michitaka 123
#9 Okawa Tadashi 114
#10 Nishijima Kazuhiro 108

Latest patents

Publication Filing date Title
WO2020116390A1 Composition, film formed from the composition, sliding member having the film, and method for producing the same
CN112166093A Composition, film formed from the composition, sliding member having the film, and method for producing the same
TW201934665A Curable silicone composition, cured product thereof, and optical semiconductor device
TW201917173A Curable silicone composition and optical semiconductor device
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TW201913830A Method for producing sealed optical semiconductor device
TW201913829A Method for producing sealed optical semiconductor device
TW201910403A Resin sheet for optical member, optical member including the same, laminated body or light-emitting element, and method for producing resin sheet for optical member
WO2019021826A1 Multicomponent-curable thermally-conductive silicone gel composition, thermally-conductive member and heat dissipation structure
CN111094458A Thermally conductive silicone gel composition, thermally conductive member, and heat dissipation structure
WO2019017227A1 Grease composition, slide member using same, and method for reducing low-frequency noise
WO2019021794A1 Aqueous coating agent composition and aqueous coating composition comprising same for lubricating film
TW201910435A Curable ruthenium composition and optical semiconductor device
TW201910434A Curable ruthenium composition and optical semiconductor device
EP3650515A1 Organopolysiloxane composition for forming pressure sensitive adhesive layer and use of same
TW201905139A 剥离Adhesive stripper composition and release film
WO2018225750A1 Silicone rubber composition for forming fixing members, and fixing member
JP2019210243A Process for producing bis-silyl amino group-containing organosilicon compounds
TW201905149A Curable cerium composition for die bonding
WO2018235491A1 Curable granular silicone composition, semiconductor member comprising same, and forming method thereof