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DH MATERIAL KK

Overview
  • Total Patents
    15
About

DH MATERIAL KK has a total of 15 patent applications. Its first patent ever was published in 2005. It filed its patents most often in Japan. Its main competitors in its focus markets macromolecular chemistry and polymers, basic materials chemistry and environmental technology are DAICEL ALLNEX LTD, BEIJING HONGSHI PAINT CO LTD and FOSHAN FUNCTIONAL POLYMER MAT AND FINE CHEMICALS PROFESSIONAL CENTER.

Patent filings in countries

World map showing DH MATERIAL KKs patent filings in countries
# Country Total Patents
#1 Japan 15

Patent filings per year

Chart showing DH MATERIAL KKs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Fujita Sachiko 10
#2 Shibata O 8
#3 Furuzono Makoto 6
#4 Tomokuni Hidehiko 3
#5 Namatame Yutaka 3
#6 Nakamura Yurie 2
#7 Osumi Shigeaki 2
#8 Ueno Junpei 2
#9 Kirisawa Koji 2
#10 Endo Yukari 2

Latest patents

Publication Filing date Title
JP2013226839A Method of manufacturing molded article
JP2013245268A Resin composition for carbon fiber-reinforced plastic, and molding material and carbon fiber-reinforced plastic using the same
JP2013053266A Molding material and molding
JP2012102193A (meth)acryloyl group-containing polyurethane, manufacturing method for (meth)acryloyl group-containing polyurethane, radically polymerizable resin composition and cured product
JP2011190357A Radically polymerizable composition, coating material, hard coating agent, and composite
JP2011021058A Method for producing molded product
JP2010260973A Radically polymerizable composition
JP2010229370A Radically polymerizable composition
JP2010150349A Radically polymerizable composition
JP2010111800A Film-forming radically polymerizable resin composition
JP2008291105A Thermosetting resin composition, molding material, molded article, method for decomposing molded article and urethane (meth)acrylate resin
JP2008163068A Cationically polymerizable resin composition for molded article, and molded article by using the same
JP2008069307A Radically polymerizable resin composition for coating and adhering
JP2008056823A Radically polymerizable unsaturated resin composition, and molded article using the same
JP2007084701A Room temperature curing unsaturated resin composition