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DATASCOPE INVESTMENT CORP

Overview
  • Total Patents
    274
About

DATASCOPE INVESTMENT CORP has a total of 274 patent applications. Its first patent ever was published in 1989. It filed its patents most often in United States, EPO (European Patent Office) and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets medical technology, biotechnology and pharmaceuticals are HUG GERHARD GMBH, SACHSE HANS E and INVATEC SPA.

Patent filings per year

Chart showing DATASCOPE INVESTMENT CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Leschinsky Boris 66
#2 Schock Robert B 41
#3 Janzen Ernst 30
#4 Williams Jonathan 30
#5 Getts Robert C 27
#6 Saper Lawrence 19
#7 Walters Daniel A 18
#8 Laksin Olga 18
#9 Urbanski Jeffrey 15
#10 Dutrieux Richard P 15

Latest patents

Publication Filing date Title
WO2008121192A1 Vascular hemostasis device and deployment apparatus
US2009105598A1 Calibration of in vivo blood pressure sensors
US2008077178A1 Device and method for sealing puncture wounds
AU2007201004A1 Device and method for compressing wounds
AU2006282832A1 Methods and kits for sense RNA synthesis
US2007027393A1 Calibration of in vivo blood pressure sensors
US2006281153A1 Methods and kits for sense RNA synthesis
CA2566794A1 Surgical stapling system
IL165684D0 Polymeric label molecules
WO2005030984A2 Method for small volume nucleic acid synthesis
US2005148812A1 Timing of intra-aortic balloon pump therapy
EP1663342A2 Dialysis catheter with stiffner
AU2003252772A1 Improved intra-aortic balloon catheter and insertion sheath
AU2003259901A1 Method and composition for forming a protective coating on an assay substrate and substrate produced by the same
AU2003243562A1 Polymeric label molecules
US2004068290A1 Device and method for compressing wounds
WO2004061126A2 Nucleic acid hybridization assay using bridging sequence
WO2004008954A1 Patient-worn medical monitoring device
US7257438B2 Patient-worn medical monitoring device
EP1465843A1 Vascular graft having a chemically bonded electrospun fibrous layer and method for making same