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CT THERM PHOTOVOLTAICS TECHNOL

Overview
  • Total Patents
    14
About

CT THERM PHOTOVOLTAICS TECHNOL has a total of 14 patent applications. Its first patent ever was published in 2007. It filed its patents most often in Germany, WIPO (World Intellectual Property Organization) and EPO (European Patent Office). Its main competitors in its focus markets semiconductors, environmental technology and packaging and shipping are FORTIX, JIANGSU SHUNFENG PHOTOVOLTAIC TECH CO LTD and DONGFANG RISEN CHANGZHOU NEW ENERGY CO LTD.

Patent filings in countries

World map showing CT THERM PHOTOVOLTAICS TECHNOLs patent filings in countries

Patent filings per year

Chart showing CT THERM PHOTOVOLTAICS TECHNOLs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Nussbaumer Hartmut 7
#2 Keller Steffen 6
#3 Esturo-Breton Ainhoa 4
#4 Rostan Philipp Johannes 3
#5 Muenzer Adolf 2
#6 Geiger Matthias 2
#7 Melnyk Ihor 2
#8 Maier Johannes 2
#9 Melnyk Ihor Dr 2
#10 Fath Peter Dr 2

Latest patents

Publication Filing date Title
DE102008056455B3 Oxidation and cleaning process for silicon wafers
DE102008056456A1 Process for producing a solar cell with a two-stage doping
WO2009056128A1 Method and device for coating solar cell substrates and solar cell
DE102008049281A1 Diffusion device for solar cell production and process for the production of solar cells
DE102008027851A1 Solar cell producing method for producing electric current, involves applying dopant source on regions, which are to be doped heavily, of solar cell substrate using ink-jet printing device
DE102008026294A1 Loading and unloading unit for plate support, has lifting device movable through receiving opening of plate support, plate transport device arranged on head of lifting device, which is provided for positioning plate
DE102008017647A1 Process for producing a solar cell with a two-stage doping
EP1965439A2 Method for texturising surfaces
DE102007036921A1 Method for producing solar cells, involves applying boron glass on part of surface of silicon wafer, and applying boron glass as etching barrier during etching of silicon wafer in texture etching solution
DE102007036296A1 Method for surface texturizing e.g. semiconductor surface and silicon surface, involves printing etch-resistant masking network on surface for texturizing, and etching surface for texturizing