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CPUMATE INC

Overview
  • Total Patents
    96
About

CPUMATE INC has a total of 96 patent applications. Its first patent ever was published in 2003. It filed its patents most often in United States, Taiwan and EPO (European Patent Office). Its main competitors in its focus markets thermal processes, semiconductors and electrical machinery and energy are CHEN SHYH-MING, LIN KUO-LEN and HUANG TSUNG-HSIEN.

Patent filings in countries

World map showing CPUMATE INCs patent filings in countries

Patent filings per year

Chart showing CPUMATE INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Lin Kuo-Len 54
#2 Cheng Chih-Hung 48
#3 Hsu Ken 47
#4 Lin Chen-Hsiang 41
#5 Wang Hwai-Ming 11
#6 Lin Guo-Ren 10
#7 Liu Wen-Jung 9
#8 Tsui Hui-Min 7
#9 Lin Kuo Len 7
#10 Cheng Chih Hung 6

Latest patents

Publication Filing date Title
US2014268798A1 Led bay light
CN104033810A LED patio lamp
TW201435242A LED patio lamp
KR20130014461A Cooler with ground heated plane and grinding method and apparatus thereof
US2014076521A1 Bidirectional heat dissipation structure
CN103672471A Active cooling LED (light emitting diode) lighting lamp
TW201413163A Active heat dissipation LED illumination lamp
CN103476221A Heat dissipation structure possessing double wind directions
TW201350683A Heat dissipation structure with double wind directions
TW201135463A Wireless heat sink, wireless heat sink system and wireless heat sinking method for the same
TW201135464A Heat sink with automatic on/off function and heat sink system, heat sinking method for the same
EP2363881A1 Heat-Dissipating Device for Supplying Cold Airflow
EP2363882A1 Heat-dissipating device for supplying cold airflow
EP2367089A1 Cooling rack structure of thermoelectric cooling type
TW201116201A Method of making coplanar evaporator sections of heat pipes with product and jig thereof
EP2298490A1 Heat conducting structure with coplanar heated portion, manufacturing method thereof, and heat sink therewith
EP2299229A1 Plurality of heat pipes and fixing assembly therefor, and heat sink
EP2312626A1 Heat pipe assembly
EP2299488A1 Heat-dissipating fin assembly with heat-conducting structure
EP2284885A1 Heat-dissipating fin capable of increasing heat-dissipating area, heat sink having such heat-dissipating fins, and method for manufacturing the same