| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 4 | |
| #2 | WIPO (World Intellectual Property Organization) | 3 | |
| #3 | EPO (European Patent Office) | 2 | |
| #4 | Canada | 1 | |
| #5 | China | 1 |
| # | Industry | |
|---|---|---|
| #1 | Audio-visual technology | |
| #2 | Computer technology | |
| #3 | Semiconductors | |
| #4 | Thermal processes |
| # | Technology | |
|---|---|---|
| #1 | Casings and printed circuits | |
| #2 | Electric digital data processing | |
| #3 | Heat-exchanger without contact | |
| #4 | Semiconductor devices |
| # | Name | Total Patents |
|---|---|---|
| #1 | Cheng Peng | 11 |
| #2 | Wu Dai Ying | 7 |
| #3 | Wen Zhe | 3 |
| Publication | Filing date | Title |
|---|---|---|
| US2020042053A1 | Modular computer cooling system | |
| US2018341298A1 | Hub-link liquid cooling system | |
| US2017257982A1 | Self-organizing thermodynamic system |