Learn more

CHEN I-MING

Overview
  • Total Patents
    26
  • GoodIP Patent Rank
    210,845
About

CHEN I-MING has a total of 26 patent applications. Its first patent ever was published in 1999. It filed its patents most often in United States, Taiwan and Republic of Korea. Its main competitors in its focus markets electrical machinery and energy, semiconductors and computer technology are ZHANJING SCI & TECH SHENZHEN, SILLS SCOTT E and ZHANJING SCIENCE & TECH (SHENZHEN) CO LTD.

Patent filings per year

Chart showing CHEN I-MINGs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Chen I-Ming 26
#2 Chen Yao-Tsung 2
#3 Lai Kun-Liang 1
#4 Chen Yi-Hung 1

Latest patents

Publication Filing date Title
US2016083999A1 Spring-assisted cordless roller shade without clutch system
US2015300086A1 Spring-assisted cordless roller shade without clutch system
WO2013138949A1 Stamped heat dissipation assembly and manufacturing method thereof
US2013120973A1 Light emitting diode bulb with a cup-shaped heat dissipating structure
US2013092362A1 Heat dissipating structure for light bulb
WO2013067658A1 Light emitting diode bulb
WO2013053081A1 Heat dissipating structure for bulb
US2012093307A1 Telephone device for detecting status of a handset with light detection
US2006231618A1 Card-reading device with port and protection mechanism
EP1713016A1 Card-reading device with port and protection mechanism
CA2502774A1 Memory-card type usb mass storage device
US2006082963A1 USB drive mass storage device with means for holding memory cards not in use
US2005259812A1 Bluetooth communication assembly
EP1246338A1 Device for charging a battery unit of a mobile telephone handset
EP1246340A1 Solar-powered device for charging a battery unit of a mobile telephone handset
TW586195B Packaging method of semiconductor dies and the product
KR20020039585A Method for mounting a semiconductor chip on a substrate and semiconductor device adapted for mounting on a substrate
TW494548B Semiconductor chip device and its package method
KR20020001949A Method for mounting a semiconductor chip on a substrate, and semiconductor device adapted for mounting on a substrate
KR20010095792A Packaged semiconductor device and method for manufacturing the same