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CHANG WAH ELECTROMATERIALS INC

Overview
  • Total Patents
    29
About

CHANG WAH ELECTROMATERIALS INC has a total of 29 patent applications. Its first patent ever was published in 2008. It filed its patents most often in Taiwan, WIPO (World Intellectual Property Organization) and EPO (European Patent Office). Its main competitors in its focus markets electrical machinery and energy, environmental technology and semiconductors are ZHEJIANG Z LIGHT OPTOELECTRONICS CO LTD, ZHEJIANG LEDISON OPTOELECTRONICS CO LTD and CHRISTY ALEXANDER C.

Patent filings per year

Chart showing CHANG WAH ELECTROMATERIALS INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Tsai Wen-Kuei 21
#2 Huang Chia Neng 5
#3 Yang Shun Cing 3
#4 Chen Zhi Ren 2
#5 Tsai Wen Kuei 1
#6 Chen Zih Ren 1
#7 Cai Wengui 1
#8 Huang Jianeng 1
#9 Wang Chun-Chien 1
#10 Wu Ching-Hua 1

Latest patents

Publication Filing date Title
TW201425811A Solid-state illuminator with air passage
TW201444407A Driver controller operating circuit, driver controller chip, and the operating method thereof
WO2014183228A1 Drive controller operating circuit, drive controller chip and operation method therefor
WO2014161102A1 Light-emitting diode lamp
TW201439466A LED light device
CN104075141A Light-emitting diode bulb
TW201437556A LED light
WO2014139045A1 Light-emitting diode lamp and decorative street light applying same
WO2014139044A1 Light-emitting diode lamp
WO2014139046A1 Light-emitting diode lamp having heat dissipation structure
TW201425808A Solid-state lighting tube assembly
TW201422975A Solid-state illuminator
TW201422982A Solid-state illuminator with air passage
TW201420948A LED light
TW201413161A Power converter contained base, lamp with power converter contained base and lamp with separable power converter contained base
JP2014067899A Package manufacturing method of flexible base material and package structure for flexible base material
KR20140039563A Process of encapsulating non-rigid substrate and the substrate
JP2014063777A Method of manufacturing light-emitting diode package and structure thereof
CN103682059A Pre-manufacturing method and pre-manufactured structure for LED package
TW201409758A Pre-process of encapsulating led and the encapsulated led