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CHAN TE-WEI

Overview
  • Total Patents
    19
About

CHAN TE-WEI has a total of 19 patent applications. Its first patent ever was published in 2007. It filed its patents most often in Taiwan, United States and Japan. Its main competitors in its focus markets optics, audio-visual technology and civil engineering are ADVANCED DISPLAY SYS INC, SONY MOBILE DISPLAY CORP and MIKUNI ELECTORON CO LTD.

Patent filings in countries

World map showing CHAN TE-WEIs patent filings in countries
# Country Total Patents
#1 Taiwan 13
#2 United States 5
#3 Japan 1

Patent filings per year

Chart showing CHAN TE-WEIs patent filings per year from 1900 to 2020

Focus industries

Top inventors

# Name Total Patents
#1 Chan Te-Wei 19
#2 Chiu Chung-Yi 4
#3 Huang Yi-Pai 2
#4 Chen Chieh-Wei 2
#5 Tsao Cheng-Han 2
#6 Su Ting-Wei 1
#7 Chang Ting-Jui 1
#8 Su Jenn-Jia 1
#9 Chen Ya-Chieh 1
#10 Chen Yen-Ting 1

Latest patents

Publication Filing date Title
TW201445034A Semi-precast hollow floor structure and a method of fabricating the same
TW201445030A Sound-insulation cushion and multi-layer floor structure using the sound-insulation cushion
TW201435184A Semi-precast hollow floor board unit structure and manufacturing method thereof
TW201341631A Fireproof and sound-insulation raised floor and manufacturing method thereof
TW201341632A Fireproof insulation wall material and its manufacturing method, and the fireproof insulation partition wall using the same
TW201122187A A method for constructing a hollow-core slab and a solid and lightweight block used in the method
JP2011098518A Two-in-one type kneading injection molding apparatus and method of using the same
TW201114993A A bi-layered slab structure and a construction method thereof
TW201102253A Two-in-one mulling and injection-molding machine and a method for utilizing the machine
TW201024507A A method for constructing a hollow-core slab and a solid and lightweight block used by the method
TW201004773A An injection-molding mold set and a multi-stage injection-molding method utilizing the mold set
TW200950946A A multi-stage mulling and injection-molding machine and a method for utilizing the machine
TW200848580A Method for constructing a lightweight, heat-insulation, and sound-insulation floorslab
TW200848581A Pod-shape fixing frame and method by using the fixing frame for constructing a lightweight, heat-insulation, and sound-insulation floorslab