BOSTIK FINDLEY INC has a total of 54 patent applications. Its first patent ever was published in 1996. It filed its patents most often in United States, Australia and Brazil. Its main competitors in its focus markets macromolecular chemistry and polymers, basic materials chemistry and machines are ATO FINDLEY INC, CHOU RICHARD T and DYNEON LLC.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 10 | |
#2 | Australia | 7 | |
#3 | Brazil | 7 | |
#4 | Canada | 6 | |
#5 | China | 6 | |
#6 | EPO (European Patent Office) | 6 | |
#7 | Mexico | 6 | |
#8 | WIPO (World Intellectual Property Organization) | 6 |
# | Technology | |
---|---|---|
#1 | Adhesives | |
#2 | Macromolecular compounds compositions | |
#3 | Unspecified technologies | |
#4 | Object sterilising | |
#5 | Compounding ingredients | |
#6 | Layered products | |
#7 | Unspecified technologies | |
#8 | Packaging | |
#9 | Implantable devices |
# | Name | Total Patents |
---|---|---|
#1 | Alper Mark | 19 |
#2 | Wang Baoyu | 17 |
#3 | Zhang Chongyao | 16 |
#4 | Strelow Diane M | 12 |
#5 | Svenningsen Lacretia A | 11 |
#6 | Hoppa-Willbrandt Marihelen | 8 |
#7 | Svenningsen Lacretia | 8 |
#8 | Strelow Diane | 8 |
#9 | Gibes Mark A | 7 |
#10 | Mehta Atul | 7 |
Publication | Filing date | Title |
---|---|---|
US7326042B2 | Apparatus for packaging hot melt adhesives using a mold and carrier | |
US6653385B2 | Hot melt adhesive composition based on a blend of amorphous poly-α-olefin and syndiotactic polypropylene | |
US6491776B2 | Dual adhesive application for laminating elastic webs | |
US6664309B2 | Antimicrobial hot melt adhesive | |
US6329468B1 | Hot melt adhesive based on semicrystalline flexible polyolefins | |
US6380292B1 | Hydrophilic hot melt adhesive |