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BOS BERLIN OBERSPREE SONDERMAS

Overview
  • Total Patents
    34
About

BOS BERLIN OBERSPREE SONDERMAS has a total of 34 patent applications. Its first patent ever was published in 1993. It filed its patents most often in Germany, WIPO (World Intellectual Property Organization) and Australia. Its main competitors in its focus markets machine tools, audio-visual technology and machines are SUZHOU BOAO PLASTIC ELECTRON CO LTD, METCAL INC and MGA TECH.

Patent filings in countries

World map showing BOS BERLIN OBERSPREE SONDERMASs patent filings in countries

Patent filings per year

Chart showing BOS BERLIN OBERSPREE SONDERMASs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Butzke Guenter 24
#2 Schimko Richard 21
#3 Muschick Juergen 11
#4 Kaiser Thomas 9
#5 Bindl Enrico 8
#6 Gretzschel Hans-I 7
#7 Gassmann Joerg 6
#8 Schilling Frank 4
#9 Butzke Guenter Dipl Phys 4
#10 Munzke Karl-Heinz 4

Latest patents

Publication Filing date Title
DE10321260A1 Special purpose machine tool for electronic circuit boards has board moved under computer control relative to fixed cutting tools
AU2003232238A1 Forming device for the production of a component-supporting tape for electronic parts
DE10229377A1 Molding unit for producing a component carrier band, comprises a forming tool with upper and lower sections, that enable pockets to be formed
DE10221102A1 Perforation device for fabrication of tapes carrying computer chips, etc. has spiked roller with spikes engaging into holes in perforation roller, at the same time driving tape and perforated roller
DE10220963A1 Molding unit for molding component carrier bands, comprises a molding tool, a closing unit connected to the tool, a transport unit, a stamper and a die
DE10144099A1 Method for processing circuit boards, esp. for SMD components, involves applying solder flux material in oxygen-free atmosphere
DE10144097A1 Method for processing circuit boards, esp. circuit boards for SMD and THT components, requires using flow device to remove solder remaining in through hole
DE10144098A1 Method for processing circuit boards esp. for SMD components, involves collecting circuit boards into at least one circuit board packet in collection step
DE10109879A1 Device for handling small components, especially electronic components for test purposes, has a handling mechanism that greatly reduces the contact force when a component is brought together with test contacts
DE10107794A1 Contact device for electronic components, e.g. for testing purposes, has contact elements with contacts arranged on face with intermediate elastic layers
DE10037448A1 Semiconductor component test fixture integrates connectors with vacuum holder
DE10030694A1 Time-controlled processing of small components, especially semiconductor components in processing and test stations by receiving and depositing components at same alignment
DE10008031A1 Method and device for filling cavities
DE10003760A1 Manufacture of plates of electromagnetic screening material from milled waste glass with added graphite or carbon
DE10004353A1 Hardening material mixture used for anticorrosive coating for buildings comprises glass particles and an alkaline activator for causing the reaction between the glass particle structure comprising silicate sections
DE19852525A1 Microwave detection electronic device for detecting harmful microwaves compares signal proportional to mean value of incident microwave radiation with threshold value for controlling display device
DE19852527A1 Sealed container closure or bottle cap incorporates electronic circuit responding to breakage of seal for providing acoustic contents information
DE19823450A1 X-ray system for testing objects, especially luggage or containers
DE19823447A1 Filling sub-mm cavities in circuit board coating with solder
DE19823448A1 Object examination device using X-rays, for inspection of luggage or containers