BOHNET HANS has a total of 15 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2006. It filed its patents most often in WIPO (World Intellectual Property Organization), EPO (European Patent Office) and China. Its main competitors in its focus markets mechanical elements, semiconductors and optics are B K M INC, ZHDANOV MIKHAIL GEORGIEVICH and MPR S R L.
# | Country | Total Patents | |
---|---|---|---|
#1 | WIPO (World Intellectual Property Organization) | 6 | |
#2 | EPO (European Patent Office) | 3 | |
#3 | China | 2 | |
#4 | United States | 2 | |
#5 | Australia | 1 | |
#6 | Germany | 1 |
# | Industry | |
---|---|---|
#1 | Mechanical elements | |
#2 | Semiconductors | |
#3 | Optics | |
#4 | Machines | |
#5 | Civil engineering | |
#6 | Surface technology and coating |
# | Technology | |
---|---|---|
#1 | Pipes | |
#2 | Shaping of plastics | |
#3 | Photomechanical semiconductor production | |
#4 | Semiconductor devices | |
#5 | Sewers | |
#6 | Devices for applying fluent materials |
# | Name | Total Patents |
---|---|---|
#1 | Eitel Jens | 12 |
#2 | Bohnet Hans | 5 |
#3 | Thiel Klaus-Peter | 2 |
#4 | Thiel Klaus | 1 |
Publication | Filing date | Title |
---|---|---|
AU2019222129A1 | Sealing sleeve for inserting into a piping system | |
WO2017157693A1 | Gasket for inserting into a pipeline system | |
DE102012113089A1 | Method for sealing a pipeline system | |
EP2635936A2 | Arrangement for the production of structured substrates | |
CN103109125A | Method and system for sealing a pipeline system | |
WO2007076739A2 | Coating installation for wafers |