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BMG INC

Overview
  • Total Patents
    38
  • GoodIP Patent Rank
    217,854
  • Filing trend
    ⇩ 100.0%
About

BMG INC has a total of 38 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 1987. It filed its patents most often in EPO (European Patent Office), United States and Japan. Its main competitors in its focus markets medical technology, macromolecular chemistry and polymers and machines are KLEINER LOTHAR W, SEALANTIUM MEDICAL LTD and CRESILON INC.

Patent filings per year

Chart showing BMG INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Hyon Suong-Hyu 21
#2 Nakajima Naoki 12
#3 Gen Shokyu 9
#4 Konda Masakazu 8
#5 Sugai Hajime 6
#6 Oka Masanori 5
#7 Tsutsumi Sadami 5
#8 Gen Jiyoukiyuu 4
#9 Matsumura Kazuaki 3
#10 Hyon Suong Hyu 2

Latest patents

Publication Filing date Title
JP2019092645A Medical adhesive excellent in self-decomposition and adhesiveness, and powder spray device therefor
JP2016063919A Medical powder spray device
KR20090083484A Self-degradable adhesive for medical use of two-component reactant system comprising powder-liquid or powder-powder
US2008319101A1 Medical-use two part reactive adhesive and medical-use resin having self-degradation property
JP2007313263A Biodegradable and absorbent bone fixation material with high strength/high elastic modulus
WO2006080523A1 Self-degradable two-component reactive adhesive for medical use and resin for medical use
JP2005219469A Polymer molded article excellent in lubricity, and its production method
JP2005220333A Biologically decomposable and absorbable polymer and method for producing the same
EP2269449A2 A composition for the protection and preservation of organs, tissues or cells and the use thereof
JP2004337549A Shock absorptive bone joining implant and its manufacturing method
US2002119946A1 Formative agent of protein complex
US6949254B2 Bio-decomposable polymer composition showing good thermal decomposition
US6168626B1 Ultra high molecular weight polyethylene molded article for artificial joints and method of preparing the same