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BECK WOLFGANG

Overview
  • Total Patents
    19
About

BECK WOLFGANG has a total of 19 patent applications. Its first patent ever was published in 1977. It filed its patents most often in Germany, United States and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets environmental technology, semiconductors and basic materials chemistry are LIN ZHENKUN, SHANGHAI MIFANG ELECTRONIC TECH CO LTD and WU YUTAO.

Patent filings per year

Chart showing BECK WOLFGANGs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Beck Wolfgang 17
#2 Kirchler Anja 3
#3 Beck Andreas 3
#4 Krichler Anja 2
#5 Umlauf Bernhard 1
#6 Mosig Ernst 1
#7 Mayer Stefan 1
#8 Beck Wolfgang Prof Dr 1
#9 Haas Katharina 1
#10 Bertsch Klaus 1

Latest patents

Publication Filing date Title
DE102007055937A1 Thermal transmitter for the energetic use of heat radiation and convection
DE102007008670A1 Use of the viscosity-controlling carbon nanotubes in binder systems and solvent-free coating material with carbon nanotubes based on functional reactants for in-mold coating (IMC) and top coating, and process for the production thereof
DE102006019137A1 Coating material for in-mold coating (IMC) based on an amino-functional reaction partner for isocyanates and process for the preparation
DE102005023378B3 Solvent-free coating material, useful for in-mould-coating, comprises component from an aliphatic isocyanate and component with a cross-linkable binder
DE19816922A1 Synthetic cyclic peptides used as models for conformational analysis and as potential drugs
DE4011157A1 Laying artificial sealing strips on yielding subsoil - by placing one strip overlapping another with edges then raised upright
DE3830594A1 Circulation system for hot-water pipes
CA1282315C Fuel operated vehicle heater
DD152025A1 Substrate for printed circuits with inserted semiconductor chips
DE2838724A1 Cpds. of transition metals with tetra:thio-quadratic acid - useful as electrically conductive materials
DD130700A1 Method for mounting semiconductor chips on component elements