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BEAC KK

Overview
  • Total Patents
    21
  • GoodIP Patent Rank
    118,293
  • Filing trend
    ⇩ 62.0%
About

BEAC KK has a total of 21 patent applications. It decreased the IP activity by 62.0%. Its first patent ever was published in 2004. It filed its patents most often in Japan. Its main competitors in its focus markets packaging and shipping, machine tools and machines are CHONGQING XIESHI ADHESIVE PRODUCTS CO LTD, WUXI SHANXIU TECH CO LTD and KAMPF MASCHF ERWIN.

Patent filings in countries

World map showing BEAC KKs patent filings in countries
# Country Total Patents
#1 Japan 21

Patent filings per year

Chart showing BEAC KKs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Kato Kazuhiko 21
#2 Yagi Takeo 10
#3 Hanyu Shinichi 7
#4 Kaneshiro Yusuke 1
#5 Nakazato Tatsuki 1
#6 Arakaki Ryosuke 1

Latest patents

Publication Filing date Title
JP2021009931A Sticking device and sticking method
JP2020189426A Sticking apparatus and sticking method
JP2020107761A Laminated substrate manufacturing apparatus, laminated substrate manufacturing line, and laminated substrate manufacturing method
JP2019048724A Film member affixing device
JP2019099346A Film member sticking apparatus and film member sticking method
JP2019102626A Release film peeling method and release film peeling device
JP2018193243A Film member sticking device, film member sticking method and static electricity removing member
JP2019064032A Coverlay film piece applying apparatus
JP2018104196A Film member sticking device, film member sticking method and guide member
JP2019021849A Reinforcing plate bonding apparatus
JP2018192489A Punching device
JP2018115050A Member affixing apparatus
JP2015209214A Member affixing device
JP2015049356A Exposure apparatus
JP2014135460A Part carrier device
JP2013115332A Exposure device, exposure device unit, and method for alignment of exposed member to mask
JP2011148007A Punching device, die for punching and method for exchanging mold for punching
JP2011156869A Device for sticking reinforcement board, die for punching reinforcement board, cutting device for producing reinforcement board, flexible substrate and electronic appliance
JP2012051059A Cutting device
JP2005313270A Boring device, boring die, boring die carrying device, and boring die changing method