AVAGO TECHNOLOGIES SENSOR IP S has a total of 11 patent applications. Its first patent ever was published in 2003. It filed its patents most often in Japan, Germany and United States. Its main competitors in its focus markets semiconductors, audio-visual technology and electrical machinery and energy are ROSNES CORP, SMIC INTEGRATED CIRCUIT (NINGBO) CO LTD and ETOH TAKEHARU.
# | Country | Total Patents | |
---|---|---|---|
#1 | Japan | 4 | |
#2 | Germany | 3 | |
#3 | United States | 3 | |
#4 | China | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Audio-visual technology | |
#3 | Electrical machinery and energy | |
#4 | Optics |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Television | |
#3 | Optical systems | |
#4 | Casings and printed circuits | |
#5 | Electric machines not otherwise provided for |
# | Name | Total Patents |
---|---|---|
#1 | Silsby Christopher D | 2 |
#2 | Gazeley William G | 2 |
#3 | Loong Chin Yee | 1 |
#4 | Bahl Sandeep R | 1 |
#5 | Baer Richard L | 1 |
#6 | Bahl Sandeep R Lamaster Freder | 1 |
#7 | Matthews James Albert | 1 |
#8 | Singh Gurbir | 1 |
#9 | Borg Matthew M | 1 |
#10 | Borg Matthew Michael | 1 |
Publication | Filing date | Title |
---|---|---|
US2005285479A1 | Devices with mechanical drivers for displaceable elements | |
US7112774B2 | CMOS stereo imaging system and method | |
US7095621B2 | Leadless leadframe electronic package and sensor module incorporating same |