Method for processing material with laser having scanner mirrors by temperature sensor coupled in the beam path, comprises correcting the optical distortion between radiation source and sensor depending on the deflection of the mirrors
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Material processing method used during soldering of electronic components comprises a scanning mirror moving in a the beam path to guide the laser beam to a different deviating mirror
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Device for soldering electronic components, comprising pre-heating unit for soldering wire
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Method and device for spot soldering with heated solder
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Soldering with reaction solder, e.g. for use when mounting electronic components, involves separately melting two or more different solder materials and mixing them so that new alloy is formed directly at solder point
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Method and apparatus for soldering under bias
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Method and device for processing flexible circuit carriers
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Method and device for spot soldering with heated solder
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Device for soldering has a source of light like halogen or laser beams for heating up soldering wire pushed forwards mechanically
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Method for non-contact point-focal heating of material bundles light onto a processing point so as to allow a stream of gas passing through to absorb its loss of power
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Device for the contactless, localized heating of material by means of radiation
