High-frequency covering film with electromagnetic shielding function and preparing methods thereof
TW202007526A
High-frequency copper clad laminate and methods thereof
TW201944861A
Multilayer flexible printed circuits and method for preparing the same
TWI696024B
Flexible resin coated copper foil substrate and methods thereof
TW202000824A
High-speed high frequency adhesive sheet and method for preparing the same
TW202000449A
High-frequency composite circuit substrate and method for preparing the same
TW201943551A
Flexible printed circuits and method for preparing the same
TW201925403A
Multi-layered anisotropically piercing conductive adhesive tape and preparing method and fpc with shield-enhanced structure using the same
TW201930076A
High-frequency high-transmission double-sided copper foil substrate, composite material for flexible printed circuit board and production method thereof
TWI666122B
A composite material for a flexible printed circuit board and preparing method thereof
TWI664086B
Double-sided copper foil substrate with fluorine polymer and high frequency and high transmission characteristics and the preparation method thereof and composite
TW201904364A
Composite metal substrate and method for manufacturing the same and circuit board
TWI671004B
Electromagnetic interference (EMI) shielding film
TW201902704A
White cover film for led substrate and led substrate using the same
TW201829182A
Nano metal substrate for FPC and COF materials
TWI644789B
Resin composition for forming insulating glue layer and composite metal substrate structure including a first metal layer, a liquid crystal polymer layer, an insulating glue layer and a second metal layer
