| # | Country | Total Patents | |
|---|---|---|---|
| #1 | China | 4 | |
| #2 | Hong Kong | 3 | |
| #3 | Taiwan | 3 | |
| #4 | WIPO (World Intellectual Property Organization) | 3 | |
| #5 | Malaysia | 1 |
| # | Industry | |
|---|---|---|
| #1 | Surface technology and coating | |
| #2 | Environmental technology |
| # | Name | Total Patents |
|---|---|---|
| #1 | Kokubo Hironobu | 11 |
| #2 | Abe Hikaru | 7 |
| #3 | Furukata Chie | 4 |
| #4 | Toshiro Shimofusa | 3 |
| #5 | Shimofusa Toshiro | 3 |
| #6 | Hironobu Kokubo | 3 |
| #7 | Fujiwara Eiji | 3 |
| #8 | Hikaru Abe | 3 |
| #9 | Fuji-Wara Eiji | 1 |
| Publication | Filing date | Title |
|---|---|---|
| WO2014192581A1 | METHOD AND DEVICE FOR TREATING IODINE-CONTAINING ETCHING SOLUTION WHICH CONTAINS Au |