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ASAHI ENGINEERING

Overview
  • Total Patents
    497
  • GoodIP Patent Rank
    55,777
  • Filing trend
    ⇧ 75.0%
About

ASAHI ENGINEERING has a total of 497 patent applications. It increased the IP activity by 75.0%. Its first patent ever was published in 1974. It filed its patents most often in Japan, United States and EPO (European Patent Office). Its main competitors in its focus markets civil engineering, chemical engineering and environmental technology are KOREA INFRASTRUCTURE SAFETY &, WUHAN HIRUN ENG EQUIPMENT CO LTD and JSTI GROUP CO LTD.

Patent filings per year

Chart showing ASAHI ENGINEERINGs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Tokuno Mitsuhiro 70
#2 Saito Fumihiro 59
#3 Tsuda Kazutoshi 24
#4 Ishii Masaaki 22
#5 Fukunaga Tatsuya 19
#6 Sato Nobuyoshi 18
#7 Shirahama Osamu 16
#8 Kanai Jun 15
#9 Nishimura Shoji 15
#10 Shiromoto Tokinori 15

Latest patents

Publication Filing date Title
WO2021049058A1 Transport cart equipped with roll inversing mechanism
JP2020181907A Sintering device and method for electronic component
JP2020174089A Resin sealing device and resin sealing method
JP2020129626A Electronic component mounting device
JP2020107621A Mounting device of electronic component
JP2020098887A Electronic component mounting device
JP2020102474A Electronic component mounting apparatus
JP2020072521A Two-phase hollow stepping motor
JP2020031092A Resin sealing molding apparatus and resin sealing molding method
JP2019212698A Electronic component mounting apparatus
JP2019145538A Resin sealing mold, resin sealing device, and resin sealing method
JP2019102551A Mounting device for electronic component
JP2019024032A Sealing mold for resin sealing device
JP2018199931A Earth retaining structure using piles
JP2018199932A Concrete pressure receiving plate and pressure receiving structure using pressure receiving plate
JP2018008535A Transport vehicle with roll inverting mechanism
JP2018003567A Uneven settlement prevention structure
JP2017220629A Resin sealing device
JP2017199865A Resin sealing device
JP2017107980A Resin sealing device of electronic element