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ARAKAWA CHEMICAL INDUSTRIES LTD

Overview
  • Total Patents
    69
  • GoodIP Patent Rank
    25,783
  • Filing trend
    ⇩ 8.0%
About

ARAKAWA CHEMICAL INDUSTRIES LTD has a total of 69 patent applications. It decreased the IP activity by 8.0%. Its first patent ever was published in 2010. It filed its patents most often in Taiwan and Australia. Its main competitors in its focus markets macromolecular chemistry and polymers, basic materials chemistry and machines are ARAKAWA CHEM IND, DAINIPPON INK & CHEMICALS CO LTD and SHANGHAI 3N CHEMICALS CO LTD.

Patent filings in countries

World map showing ARAKAWA CHEMICAL INDUSTRIES LTDs patent filings in countries
# Country Total Patents
#1 Taiwan 67
#2 Australia 2

Patent filings per year

Chart showing ARAKAWA CHEMICAL INDUSTRIES LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Tasaki Takashi 11
#2 Shiotani Atsushi 11
#3 Koyano Hirotoshi 11
#4 Yamaguchi Takashi 10
#5 Sugimoto Keisuke 9
#6 Sawada Hiroshi 9
#7 Sato Yoshinobu 7
#8 Miyao Yoshiaki 7
#9 Yunoki Hiroshi 7
#10 Higashimoto Toru 6

Latest patents

Publication Filing date Title
TW202026487A Powdered paper strengthening agent, solution of powdered paper strengthening agent and paper
TW201934718A Antistatic agent for active energy ray-curable resin composition, active energy ray-curable resin composition, cured product, and film having excellent properties of transparency, antistatic, rub resistance, and heat and humidity resistance
TW201819458A Tackifier resin, tackifier resin emulsion, aqueous adhesive composition, and polychloroprene latex adhesive composition
TW201718715A Modified polyimide, adhesive composition, copper foil with resin, copper-clad laminate, printed circuit board and multilayer substrate having low transmission losses and low dielectric losses and excellent in heat-resistance
TW201723027A Resin composition, adhesive, film-like adhesive material, adhesive sheet, multilayer circuit board, copper foil with resin, copper clad laminate, printed circuit board
TW201700700A Polyimide-based adhesives, film-like adhesive materials, adhesive layers, adhesive sheets, copper-clad laminates and printed circuit boards, and multilayer circuit boards and methods of manufacturing the same
TW201444901A An active energy ray-curable resin composition, an active energy ray-curable resin composition, a cured film and an antistatic transparent optical film
TW201348267A A polyfunctional thio (meth) acrylate resin, an active energy ray-hardening hard coat resin composition having a hardened film obtained by hardening it, a plastic film having a hardened film laminated, and a plastic film Molding and processing products
TW201343681A A polyfunctional sulfur (meth) acrylate resin, an active energy ray-hardening hard coat resin composition containing the same, a hardened film obtained by hardening the plastic film, a plastic film having a hardened film, a plastic film And processed products