| # | Country | Total Patents | |
|---|---|---|---|
| #1 | WIPO (World Intellectual Property Organization) | 6 | |
| #2 | United States | 3 | |
| #3 | China | 2 | |
| #4 | EPO (European Patent Office) | 2 | |
| #5 | Australia | 1 | |
| #6 | Taiwan | 1 |
| # | Industry | |
|---|---|---|
| #1 | Chemical engineering | |
| #2 | Materials and metallurgy | |
| #3 | Measurement | |
| #4 | Machines | |
| #5 | Electrical machinery and energy | |
| #6 | Micro-structure and nano-technology | |
| #7 | Machine tools |
| # | Name | Total Patents |
|---|---|---|
| #1 | Nakamura Yuko | 6 |
| #2 | Kudo Takeshi | 6 |
| #3 | Ruike Azuma | 6 |
| #4 | Kawanami Fumie | 6 |
| #5 | Nashirozawa Norio | 5 |
| #6 | Teguramori Satoshi | 4 |
| #7 | Iwasaki Yuji | 4 |
| #8 | Kuzuhori Ken | 4 |
| #9 | Aiki Yoshiaki | 3 |
| #10 | Sakamoto Wakao | 2 |
| Publication | Filing date | Title |
|---|---|---|
| WO2008143110A1 | Sensor chip for detection of antigen, method for production of the sensor chip, and sensor for detection of antigen | |
| WO2008143109A1 | Sensor chip for detection of antigen, method for production of the sensor chip, and sensor for detection of antigen | |
| WO2005120141A1 | Solder jetting apparatus, solder jetting apparatus manufacturing method and electronic component soldering method | |
| EP1426107A1 | Photocatalyst material and method for preparation thereof |