AMULAIRE THERMAL TECHNOLOGY INC has a total of 14 patent applications. It increased the IP activity by 200.0%. Its first patent ever was published in 2005. It filed its patents most often in Taiwan and United States. Its main competitors in its focus markets semiconductors, thermal processes and machines are ADVANCED THERMAL SOLUTIONS INC, ALLOY KOGYO KK and DEDE ERCAN MEHMET.
# | Country | Total Patents | |
---|---|---|---|
#1 | Taiwan | 12 | |
#2 | United States | 2 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Thermal processes | |
#3 | Machines | |
#4 | Materials and metallurgy |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Unspecified technologies | |
#3 | Heat-exchanger without contact | |
#4 | Heat-exchange device details | |
#5 | Working metallic powder |
# | Name | Total Patents |
---|---|---|
#1 | Wu Chun-Lung | 6 |
#2 | Hoffman Paul | 5 |
#3 | Tandon Rajiv | 4 |
#4 | Hong Chu-Wan | 3 |
#5 | Yeh Tze-Yang | 3 |
#6 | Chan Chun-Hou | 2 |
#7 | Lin Ming-Sian | 2 |
#8 | Lin Ming Sian | 1 |
#9 | Wu Chun Lung | 1 |
#10 | Lee Che-Yin | 1 |
Publication | Filing date | Title |
---|---|---|
TWI696251B | Igbt module with improved heat dissipation structure | |
TWI693684B | Igbt module with improved heat dissipation structure | |
TW202005020A | IGBT module with heat dissipation structure | |
TW201906100A | Columnar radiating fin structure | |
TW201636567A | Heat-dissipating device and manufacturing method therefor | |
TW201634162A | Friction stir welding device and method of friction stir welding | |
US2015338176A1 | Compound heat-dissipating device | |
TW201001569A | Fluid spreader | |
TWI262286B | Heat dissipation device with better parallelism accuracy, auxiliary fixture and the manufacturing method of the heat dissipation device |