| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Taiwan | 5 | |
| #2 | United States | 5 | |
| #3 | Republic of Korea | 3 | |
| #4 | WIPO (World Intellectual Property Organization) | 3 | |
| #5 | China | 2 | |
| #6 | EPO (European Patent Office) | 1 | |
| #7 | Japan | 1 |
| # | Industry | |
|---|---|---|
| #1 | Electrical machinery and energy | |
| #2 | Audio-visual technology | |
| #3 | Semiconductors | |
| #4 | Machines |
| # | Technology | |
|---|---|---|
| #1 | Electrically-conductive connections | |
| #2 | Casings and printed circuits | |
| #3 | Semiconductor devices | |
| #4 | Unspecified technologies |
| # | Name | Total Patents |
|---|---|---|
| #1 | Hileman James S | 13 |
| #2 | Walden John D | 10 |
| #3 | Taylor Paul R | 9 |
| #4 | Pickles Charles Sands | 5 |
| #5 | Do Trent | 3 |
| #6 | Paul R Taylor | 1 |
| Publication | Filing date | Title |
|---|---|---|
| WO2020172561A1 | Interposer assembly and method | |
| US2018301835A1 | Interposer assembly and method | |
| WO2016048826A1 | Interposer assembly and method | |
| US2014162472A1 | Impedance controlled LGA interposer assembly | |
| US2014045350A1 | Interposer plate |