Polyamideimide double-sided flexible copper-clad plate and manufacture method thereof
CN104341720A
Halogen-free resin composition for resin coated copper foil for high-density printed circuit board and preparation method and application method of halogen-free resin composition
CN103923589A
Low-dielectric constant adhesive for flexible printed circuit board and application method thereof
CN102825861A
Heat-conductive two-sided flexible copper clad laminate and manufacturing method thereof
CN102516852A
Weather-resistant and high thermal conductive coating, radiating solar rear panel and efficient solar cell panel
CN102315285A
Weather-resistant coating and solar back plate using same
WO2012162863A1
Highly-efficient heat radiating led lamp and method for manufacturing same
CN102421244A
High voltage resistance metal-based circuit board and production method thereof
CN102252181A
LED (light emitting diode) lamp with low thermal resistance and preparation method thereof
CN102116432A
LED (light-emitting diode) lamp with ability of efficient heat radiation
CN102529281A
Roller pressing machine for producing metal base copper-clad plate
CN102558765A
Halogen-free fire-retardant high heat conducting insulating resin composition and heat dissipation metal-base copper clad plate
CN102529222A
High-insulation metal-based copper-clad plate with low thermal resistance and preparation method thereof
CN102036470A
Low-thermal-resistance and high-radiation metal-base circuit board
CN101921557A
Halogen-free flame-retardant adhesive composition and flexible copper-clad plate using same
CN101875825A
Halogen-free flame retardant adhesive composition and flexible copper-clad plate using same
CN101575489A
White adhesive for flexible printed circuit and preparation method thereof
CN101570679A
Filling-free polyimide bonding agent applicable to once coating
