AKM ELECTRONICS IND PANYU LTD has a total of 15 patent applications. It decreased the IP activity by 50.0%. Its first patent ever was published in 2009. It filed its patents most often in China, WIPO (World Intellectual Property Organization) and United States. Its main competitors in its focus markets audio-visual technology, electrical machinery and energy and telecommunications are GUANGDONG HI 1 NEW MATERIALS TECH RESEARCH INST CO LTD, HAGN ERWIN and GUANGDONG SONG RESEARCH ELECTRONIC TECH CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | China | 12 | |
#2 | WIPO (World Intellectual Property Organization) | 2 | |
#3 | United States | 1 |
# | Industry | |
---|---|---|
#1 | Audio-visual technology | |
#2 | Electrical machinery and energy | |
#3 | Telecommunications | |
#4 | Semiconductors | |
#5 | Environmental technology |
# | Technology | |
---|---|---|
#1 | Casings and printed circuits | |
#2 | Magnets and transformers | |
#3 | Semiconductor devices | |
#4 | Batteries | |
#5 | Reduction of greenhouse gas emissions | |
#6 | Antennas | |
#7 | Circuits for supplying electric power | |
#8 | Transmission |
# | Name | Total Patents |
---|---|---|
#1 | Pan Li | 4 |
#2 | Cui Chengqiang | 4 |
#3 | Wang Ling | 3 |
#4 | Deng Ming | 3 |
#5 | Wang Jing | 3 |
#6 | Huang Daxing | 3 |
#7 | Wu Yuchi | 2 |
#8 | Chen Zhibin | 2 |
#9 | Qi Wei | 2 |
#10 | Qingsong Xu | 1 |
Publication | Filing date | Title |
---|---|---|
CN112074096A | Drilling method for 5G high-frequency LCP material | |
CN111556662A | Flexible circuit board preparation method, flexible circuit board and electronic equipment | |
CN111370210A | Charging coil and wireless charging terminal | |
CN111430827A | Battery core temperature acquisition device, busbar and battery core | |
CN107635353A | A kind of double-faced flexible wiring board and its laser preparation method | |
CN107770953A | A kind of single-sided flexible circuit board and its pad pasting preparation method based on separable copper foil | |
CN105228344A | A kind of preparation method of buried capacitor | |
CN104320925A | Manufacture method of novel embedded type circuit board | |
CN103887185A | Manufacturing method of lead wire frame for chip packaging | |
CN103881308A | Plugging material with high thermal conductivity and preparation method of plugging material | |
CN103687293A | Stacked circuit board and manufacturing technology thereof | |
CN101736328A | Pretreatment solution and process of electroless copper plating of flexible printed circuit board |