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AKM ELECTRONICS IND PANYU LTD

Overview
  • Total Patents
    15
  • GoodIP Patent Rank
    125,963
  • Filing trend
    ⇩ 50.0%
About

AKM ELECTRONICS IND PANYU LTD has a total of 15 patent applications. It decreased the IP activity by 50.0%. Its first patent ever was published in 2009. It filed its patents most often in China, WIPO (World Intellectual Property Organization) and United States. Its main competitors in its focus markets audio-visual technology, electrical machinery and energy and telecommunications are GUANGDONG HI 1 NEW MATERIALS TECH RESEARCH INST CO LTD, HAGN ERWIN and GUANGDONG SONG RESEARCH ELECTRONIC TECH CO LTD.

Patent filings in countries

World map showing AKM ELECTRONICS IND PANYU LTDs patent filings in countries

Patent filings per year

Chart showing AKM ELECTRONICS IND PANYU LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Pan Li 4
#2 Cui Chengqiang 4
#3 Wang Ling 3
#4 Deng Ming 3
#5 Wang Jing 3
#6 Huang Daxing 3
#7 Wu Yuchi 2
#8 Chen Zhibin 2
#9 Qi Wei 2
#10 Qingsong Xu 1

Latest patents

Publication Filing date Title
CN112074096A Drilling method for 5G high-frequency LCP material
CN111556662A Flexible circuit board preparation method, flexible circuit board and electronic equipment
CN111370210A Charging coil and wireless charging terminal
CN111430827A Battery core temperature acquisition device, busbar and battery core
CN107635353A A kind of double-faced flexible wiring board and its laser preparation method
CN107770953A A kind of single-sided flexible circuit board and its pad pasting preparation method based on separable copper foil
CN105228344A A kind of preparation method of buried capacitor
CN104320925A Manufacture method of novel embedded type circuit board
CN103887185A Manufacturing method of lead wire frame for chip packaging
CN103881308A Plugging material with high thermal conductivity and preparation method of plugging material
CN103687293A Stacked circuit board and manufacturing technology thereof
CN101736328A Pretreatment solution and process of electroless copper plating of flexible printed circuit board