|
CN112079868A
|
|
Halogen-free flame-retardant cyclotriphosphazene maleimide resin, laminated board and preparation method thereof
|
|
CN112080111A
|
|
High-heat-resistance low-dielectric epoxy resin composition, laminated board and preparation method of laminated board
|
|
CN112079820A
|
|
Halogen-free flame-retardant trichlorocyanic maleimide resin, laminated board and preparation method thereof
|
|
CN111777541A
|
|
high-Tg low-dielectric active ester curing agent, preparation method and application
|
|
CN111777751A
|
|
high-Tg low-dielectric self-crosslinking active ester curing agent and preparation method and application thereof
|
|
CN111055585A
|
|
Flame-retardant low-dielectric copper-clad plate and preparation method thereof
|
|
CN111018769A
|
|
High-heat-resistance bismaleimide resin, preparation method and application
|
|
CN111019103A
|
|
Liquid crystal polyester soluble in conventional aprotic solvent and preparation method thereof
|
|
CN111019346A
|
|
Flame-retardant high-heat-resistance resin composition, copper-clad plate and preparation method thereof
|
|
CN110804114A
|
|
Water-soluble halogen-free flame retardant and preparation method of flame-retardant finished cotton fabric thereof
|
|
CN110683980A
|
|
Method for continuously synthesizing maleimide by microchannel reactor
|
|
CN110655791A
|
|
High heat-resistant low-dielectric active ester resin composition and preparation method of laminated board
|
|
CN110724261A
|
|
High-heat-resistance low-dielectric polyphenylene ether type bismaleimide resin, laminated board and preparation method thereof
|
|
CN110790899A
|
|
Flame-retardant isocyanurates curing agent, epoxy resin composition for copper-clad plate and preparation method of epoxy resin composition
|
|
CN110790900A
|
|
Flame-retardant triazine active ester curing agent, epoxy resin composition for copper-clad plate and preparation method thereof
|
|
CN110776739A
|
|
Thermosetting resin composition for high-speed substrate, copper-clad plate and preparation method of copper-clad plate
|
