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AGC TECH CO LTD SHENZHEN SUCCESS

Overview
  • Total Patents
    20
  • GoodIP Patent Rank
    84,890
  • Filing trend
    0.0%
About

AGC TECH CO LTD SHENZHEN SUCCESS has a total of 20 patent applications. It increased the IP activity by 0.0%. Its first patent ever was published in 2016. It filed its patents most often in China. Its main competitors in its focus markets surface technology and coating, semiconductors and chemical engineering are ROHCO INC, OM SANGYO CO LTD and DR ING MAX SCHLOETTER GMBH & CO KG.

Patent filings in countries

World map showing AGC TECH CO LTD SHENZHEN SUCCESSs patent filings in countries
# Country Total Patents
#1 China 20

Patent filings per year

Chart showing AGC TECH CO LTD SHENZHEN SUCCESSs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Yao Jihao 10
#2 Yao Yu 8
#3 Wang Jiangfeng 8
#4 Wang Wenzhen 6
#5 Wang Hui 5
#6 Shen Wenbao 4
#7 Hong Xueping 3
#8 Qiu Yanqiang 3
#9 Liu Ke 2
#10 Yao Cheng 2

Latest patents

Publication Filing date Title
CN111945192A Blind hole filling electro-coppering solution for HDI (high Density interconnect) board and carrier board
CN111880384A Environment-friendly degumming agent for removing photoresist on surface of wafer
CN111892995A Soldering flux cleaning agent for chip packaging process
CN111922553A Copper surface protective agent for advanced wafer packaging field and preparation method thereof
CN111424296A Electroplating copper solution for filling through holes of IC carrier plate and electroplating method
CN111441071A Electroplating solution and electroplating method for double-sided copper plating of glass through hole
CN110541179A electroplating copper solution and electroplating method for wafer-level packaging super TSV copper interconnection material
CN110229332A The cage-type silsesquioxane polyamic acid polymer and preparation method thereof of resistant to plasma etching
CN110158066A Environment-friendly type can inhibit the solution of tetravalent tin generating rate
CN110093598A For protecting the tin face protective agent of chemical tin coating
CN109326532A The etch-proof processing method of scolding tin in a kind of semiconductor fabrication process
CN108754590A Conducting ring, based on its for electric installation and based on the electroplate jig for electric installation
CN108889309A Multicomponent mixture catalyst of single application and preparation method thereof
CN106939417A The chemical plating stannum formula of printed wiring board
CN106987829A Apply the chemical nickel formula in the chemical NiPdAu coating of FPC
CN106987830A Aluminium base printed wiring board chemistry NiPdAu technique
CN106757212A For the ELECTROPLATING Sn-Ag ALLOY solution of wafer-level packaging
CN106752689A Paints Curing under Water and preparation method thereof
CN106011810A Removing process of tetravalent tin in chemical tin plating liquid of copper substrate
CN105797716A Non-noble metal catalyst for efficiently purifying organic waste gas OMS-2 and preparation method thereof