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ADVANCED FLEXIBLE CIRCUITS CO LTD

Overview
  • Total Patents
    30
  • GoodIP Patent Rank
    58,387
  • Filing trend
    ⇩ 12.0%
About

ADVANCED FLEXIBLE CIRCUITS CO LTD has a total of 30 patent applications. It decreased the IP activity by 12.0%. Its first patent ever was published in 2013. It filed its patents most often in United States, China and Taiwan. Its main competitors in its focus markets audio-visual technology, electrical machinery and energy and machines are YOUNGEUN ELECTRONICS CO LTD, SAKAMOTO KATSUHIKO and XIAMEN BOLION TECH CO LTD.

Patent filings in countries

World map showing ADVANCED FLEXIBLE CIRCUITS CO LTDs patent filings in countries
# Country Total Patents
#1 United States 16
#2 China 7
#3 Taiwan 7

Patent filings per year

Chart showing ADVANCED FLEXIBLE CIRCUITS CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Su Kuo-Fu 22
#2 Lin Gwun-Jin 18
#3 Chuo Chih-Heng 17
#4 Zhuo Zhi-Heng 4
#5 Su Guo-Fu 4
#6 Lin Kun-Jin 3
#7 Su Kuo Fu 2
#8 Chuo Chih Heng 2
#9 Lin Gwun Jin 2
#10 Zhuo Zhiheng 1

Latest patents

Publication Filing date Title
TW202021436A Conductive circuit structure including conductive resin layer wherein the conductive circuit structure includes a conducting layer disposed between a first circuit board and a second circuit board
US10159143B1 Attenuation reduction structure for flexible circuit board
US2019067847A1 Pressure adaptive contact structure for flexible circuit board
US10080277B1 Attenuation reduction structure for flexible circuit board
TW201914108A Stacked insertion structure for flexible circuit board using an adhesive layer to bond a fold-back section with an insertion section or using a height adjustment layer to adjust a height between the two
CN109413852A With the connection structure of the corresponding overlapping of flexible circuit board
US2019045633A1 Stacked flexible printed circuit board assembly with side connection section
TW201836443A Attenuation reduction structure for flexible circuit board
TW201740774A Circuit board structure capable of selecting corresponding grounding layer for enhancing signal transmission quality and meeting requirements of trace width dimension and layout space
TW201739111A Connection structure having correspondingly stacked flexible circuit boards capable of being adapted to thickness requirement during actual inserting or welding application
TW201503781A Wearable assembly method of flexible circuit board and shaft member